Wafer-level magnetics for next-generation power delivery
Compute is no longer limited by logic. It is limited by power.
EnaChip enables a new class of power delivery technology—integrating magnetics at the wafer level to deliver power closer to silicon with greater efficiency, density, and scale.
Manufacturable at wafer scale
Optimized for high-frequency power delivery
Enables vertical power integration
Backed by semiconductor and deep-tech experts
The evolution of power delivery
From discrete magnetics to a fully integrated compute stack.
As AI systems scale, the constraint is no longer logic. It is how efficiently power reaches the load.
Power delivered far from silicon introduces parasitic loss, board-level sprawl, and thermal burden. EnaChip changes that architecture by fabricating magnetic structures directly in semiconductor-compatible flows—moving regulation closer to the die and reducing the distance between power and compute.
Higher efficiency
Lower thermal load
Smaller systems
Faster response
Discrete power delivery
Bulky board-level magnetics keep regulation far from silicon and waste space the system can no longer afford.
Package-level integration
Power moves closer to the load, but packaging complexity and limited scalability still hold the architecture back.
Wafer-level integration
EnaChip enables localized power delivery within the chip stack for better density, efficiency, and transient response.
Data movement limits performance
Longer power paths introduce parasitics and reduce responsiveness under dynamic workloads.
Power inefficiency increases cost
System loss raises cooling demand, energy consumption, and total cost of ownership.
System complexity keeps growing
Board-level components occupy precious area that advanced packaging and compute can no longer spare.
A new foundation for compute infrastructure
Materials, manufacturing, and system architecture—aligned as one platform.
EnaChip brings magnetics into the semiconductor domain, combining advanced magnetic materials, electrochemical wafer fabrication, and system-level integration into a unified power delivery platform.
Advanced magnetic alloys
High-flux, high-resistivity electroplated materials suppress eddy-current loss and enable efficient operation in the MHz regime.
Electrochemical wafer processes
Continuous electroplating enables laminated cores and thick copper with far fewer masks and dramatically lower process complexity.
High-density integrated devices
Inductors, transformers, coils, and multi-layer magnetic structures can be fabricated directly at wafer scale.
Architectural impact
Moving power closer to the die reduces IR drop, lowers thermal burden, and unlocks higher compute density.
Fewer steps. Higher frequencies. Wafer-scale manufacturability.
Continuous electroplating replaces slow, multi-mask thin-film approaches and makes high-density magnetic structures practical inside semiconductor flows.
~10×
Fewer process steps
~3×
Lower manufacturing cost
Hours
Instead of days
Applications
Powering the systems defining the future.
EnaChip’s wafer-level magnetics platform is designed for the power density, integration, and efficiency demands emerging across the most advanced electronic systems.
AI & data centers
Increase compute density, reduce energy loss, and improve the economics of power and cooling at infrastructure scale.
Advanced packaging & chiplets
Enable localized regulation for chiplet-based and 3D architectures that need power to move closer to the die.
Edge & compact systems
Deliver smaller, lighter, and more efficient power systems where every millimeter and every watt matter.
One magnetics platform, multiple system functions.
Power management, signal conditioning, sensing, energy harvesting, and actuation can be co-designed in a single wafer-level layer.
See ApplicationsBuilt at the intersection of materials, semiconductors, and systems
Leadership designed for hard problems—and manufacturable solutions.
Selected leaders and board members from the provided EnaChip materials, presented in a tighter homepage format.
CEO
Mark Popovich
Commercializing a new class of integrated power delivery technology for next-generation compute systems.
Co-Founder & CTO
Mark Allen
Deep expertise in MEMS, semiconductor processing, and microfabricated magnetics for advanced power delivery.
Board Member
Anupam Ghildyal
Experience building and scaling companies across semiconductors, advanced manufacturing, materials, and energy.
Board Member
Jim Cable
Semiconductor and R&D leadership across advanced electronics and high-performance manufacturing systems.
Toward a fully integrated compute stack
Power delivery should scale with performance—rather than limit it.
Today’s systems are still built as separate layers. EnaChip is building the magnetic layer that enables compute, packaging, and power to be designed as one system.