About Us
EnaChip is building a new foundation for power delivery—bringing together advances in materials science, semiconductor processing, and system architecture.
We approach the problem from first principles, with a focus on solutions that are technically advanced, manufacturable, and scalable across the semiconductor ecosystem.
Materials electrochemistry + magnetic alloys · Semiconductors processing + packaging alignment · Systems integration + architecture · Unified platform power delivery designed into the stack
A fundamentally interdisciplinary approach
Advances in compute have outpaced the infrastructure that powers them. EnaChip bridges that gap by spanning materials, manufacturing, and system design in one coordinated approach.
EnaChip is not developing a single component. We are building a new platform for power delivery that integrates deeply into the semiconductor ecosystem, with alignment to manufacturing processes, packaging technologies, and system requirements.
Our mission is to remove power delivery as a constraint on technological progress—so the next generation of compute systems can reach higher performance, efficiency, and scale.
Leadership
Semiconductor and advanced materials executive with 30+ years building and scaling technology-driven businesses across the semiconductor ecosystem.
Leader in MEMS and integrated magnetics for advanced power delivery with deep academic and research leadership.
Power magnetics expert with 40+ years of experience designing and commercializing high-frequency magnetic components.
Experienced semiconductor executive leading EnaChip with deep expertise in packaging, materials, and commercialization.
Veteran semiconductor executive with 40+ years across technology development, commercialization, and company building.
Investor and builder across deep tech, manufacturing, and energy systems with a track record of launching and scaling companies.
Investor focused on commercialization of breakthrough technologies and early-stage company building.
Partners
EnaChip operates at a critical inflection point in the technology stack, and we partner with organizations that recognize both the scale of the problem and the importance of solving it correctly.
Our work sits at the intersection of semiconductors, materials, and systems. We collaborate with foundries, packaging providers, chip designers, system integrators, and infrastructure operators so our platform can fit naturally into existing and emerging architectures.
EnaChip is not a standalone component supplier. We are building a platform technology that integrates across the stack, and our partnerships reflect that—co-developing solutions, accelerating adoption, and enabling new system capabilities.
Investors
Focused on transformative technologies across semiconductors, advanced manufacturing, and deep-tech sectors.
Partners with industrial and life science technology companies in materials, manufacturing, and energy systems.
Early-stage venture firm backing category-defining technology companies at the seed and Series A stages.
Mission
Our mission is to remove power delivery as a constraint on technological progress and enable the next generation of compute systems to reach their full potential.
Mark Popovich is a seasoned semiconductor and advanced materials executive with more than three decades of experience building and scaling technology-driven businesses. He has led companies across the semiconductor packaging, electronic materials, and advanced manufacturing ecosystem, with a strong track record of commercializing new technologies and driving growth at scale.
Most recently, Mark served as CEO of 3D Glass Solutions, where he transformed the company from an R&D-focused startup into a manufacturing and revenue-generating business, raising over $50 million and establishing strategic partnerships with leading industry players including Lockheed Martin, Intel Capital, and Murata. Earlier in his career, Mark held senior leadership roles at Henkel, where he led global electronic materials businesses and corporate venture initiatives, and at Amkor Technology, where he played a key role in expanding global operations and forming strategic joint ventures in semiconductor packaging. He was also a founding member of ChipPAC, helping scale the company through early growth to a successful IPO.
Across his career, Mark has consistently operated at the intersection of materials innovation, semiconductor manufacturing, and system-level integration. At EnaChip, he is leading the company’s effort to bring magnetics into the semiconductor stack—positioning it at the forefront of the next major shift in power delivery and compute architecture.
Mark Allen received undergraduate degrees in chemistry, chemical engineering, and electrical engineering from the University of Pennsylvania (Penn), and the S.M. and Ph.D. degrees from the Massachusetts Institute of Technology. In 1989 he joined the faculty of the School of Electrical Engineering (later ECE) of the Georgia Institute of Technology (GT), ultimately holding the rank of Regents’ Professor and the J.M. Pettit Professorship in Microelectronics. He also served in multiple administrative roles at GT, including Senior Vice Provost for Research and Innovation, and Director of the Institute for Electronics and Nanotechnology (IEN).
In 2013 he returned to Penn to become the Alfred Fitler Moore Professor and Director of Penn’s Singh Center for Nanotechnology. In 2024 he became Chair of Penn’s Department of Electrical and Systems Engineering. Mark’s research is in the area of microelectromechanical systems (MEMS). Beginning with a plenary address to the 1994 IEEE Applied Power Engineering Conference on the topic of integrated inductors, and continuing through today, a major thrust of his program is the realization of microfabricated magnetics for advanced power delivery. He has chaired or co-chaired multiple conferences and co-founded multiple MEMS companies.
Mark is a Fellow of the IEEE, a Fellow of the National Academy of Inventors, and a member of the National Academy of Engineering.
Matt Wilkowski’s career spans more than forty years of shaping, advancing, and redefining the field of power magnetics. His work encompasses the full lifecycle of magnetic component creation—from translating circuit concepts into magnetic design parameters to material selection, validation, qualification, and long-term reliability.
His leadership in international standardization culminated in guiding the transformation of IEC 3671 into IEC 620442, the first standard to formally define methods for measuring AC power loss in magnetic materials.
Across roles at Bell Labs, Lucent, Tyco, Enpirion, Altera, Intel, Wurth, and EnaChip, Wilkowski has successfully introduced and commercialized thousands of high-reliability power magnetic components. At Enpirion, he pioneered the integration of magnetic components into semiconductor packaging, enabling the world’s first Power Supply on Chip with wafer-level magnetics operating at 22 MHz. Matt is a Fellow of the IEEE.
Mark Popovich is a seasoned semiconductor and advanced materials executive with more than three decades of experience building and scaling technology-driven businesses. He has led companies across semiconductor packaging, electronic materials, and advanced manufacturing, with a strong track record of commercializing new technologies.
Most recently, Mark served as CEO of 3D Glass Solutions, where he transformed the company from an R&D-focused startup into a manufacturing and revenue-generating business, raising over $50 million and securing partnerships with industry leaders including Lockheed Martin, Intel Capital, and Murata. He previously held senior leadership roles at Henkel and Amkor Technology, and was a founding member of ChipPAC.
At EnaChip, Mark is leading the effort to bring magnetics into the semiconductor stack—enabling the next generation of power delivery and compute architectures.
Jim Cable is a veteran semiconductor executive with more than four decades of experience spanning technology development, commercialization, and company building. He previously served as CEO of Peregrine Semiconductor (now pSemi, a Murata company), where he led the company from early growth through IPO and eventual acquisition, helping establish silicon-on-insulator (SOI) as a foundational technology used in nearly every modern smartphone today.
Jim has held senior leadership roles across the semiconductor ecosystem, including Chief Strategy Officer and Chairman at Finwave Semiconductor, and advisory or board positions at leading technology companies in RF, power, materials, and advanced manufacturing. He brings deep expertise across CMOS, GaN, photonics, and RF systems, along with extensive experience in M&A, venture-backed scaling, and strategic partnerships.
A prolific innovator, Jim is the inventor or co-inventor on more than 100 patents and has authored over 50 technical publications. He holds a PhD in Electrical Engineering from UCLA and is a member of IEEE.
Anupam is a General Partner at Stata Capital and a Venture Partner at Boston Seed Capital. Anupam has been integral in building over ten startups, serving as a co-founder, founding team member, or founding investor across the manufacturing, materials, energy, and technology sectors. He co-founded companies focused on breakthrough innovations including low-cost direct lithium extraction, battery regeneration, and domestic production of rare-earth materials. He was also part of the founding team at VulcanForms.
Anupam has a track record of accelerating early- and growth-stage companies from ideation to full commercialization. He has helped launch over 20 products, raised more than $1 billion in funding, and established manufacturing and sales operations globally.
Michael is a Partner at Anzu Partners and the Founder of Longview Innovation, where he has led investments in breakthrough technologies developed in partnership with leading U.S. universities and national labs. Under his leadership, Longview has built strategic relationships with top research institutions and played a key role in commercializing early-stage innovations.
Michael brings over 15 years of experience in early-stage investing and international capital markets. He previously held senior roles at Lehman Brothers and Barclays Capital in London, and later served as Managing Director of Capital Markets for a global technology investment firm. He also served as CFO of the Climate Group. Michael holds a B.S. from Bucknell University and an M.B.A. from London Business School.
