AI & Data Centers
Higher compute density with lower cooling and energy burden.
Applications
Across industries, the same constraint is emerging: power delivery is limiting system performance, efficiency, and scalability. EnaChip’s technology is designed to address this constraint across the most demanding and fastest-growing markets.
Higher compute density with lower cooling and energy burden.
Localized regulation for chiplets and 3D integration.
Smaller, lighter, more capable devices in tighter footprints.
More compact and scalable power electronics beyond compute.
Where the constraint shows up first
The same bottleneck appears in different forms: more compute density, more localized regulation, smaller form factors, and higher efficiency across the stack. Integrated magnetics can support power management, signal conditioning, sensing, harvesting, and actuation within a single semiconductor-compatible platform.
Power density is increasing at an unprecedented rate. EnaChip enables more efficient power conversion and delivery so operators can increase compute density while reducing energy usage and cooling requirements.
Traditional board-level power delivery cannot keep up with chiplets and 3D integration. EnaChip enables power to move into the package where localized, high-speed regulation becomes possible.
Smaller systems need lighter, thinner, and more efficient power components. EnaChip supports higher functionality inside constrained form factors.
The same integrated magnetic platform can extend into adjacent systems that require compact conversion, filtering, and actuation.
Expanding the role of magnetics across the system
EnaChip’s magnetics platform extends beyond traditional power delivery. Select a capability to see where integrated magnetic functionality can create new system value.
Most immediate application
Power delivery is the most immediate and impactful application of EnaChip’s technology. By enabling compact, high-efficiency magnetic components, the platform supports next-generation DC/DC voltage regulation and integrated power management systems.
Signal integrity
Integrated filtering solutions—including low-pass and band-pass filters, tuners, and RF suppression components—can move directly into the package or chip-level environment.
Sensing
Magnetic sensing can be integrated into advanced systems where local field detection and compact packaging matter.
Energy conversion
Integrated magnetic structures can support small-form-factor energy harvesting approaches that benefit from semiconductor-compatible fabrication and scaling.
Actuation
Micro-scale electromagnetic actuation can be co-designed with control electronics and package constraints from the beginning.
A unified platform
What connects these applications is a single underlying capability: the integration of magnetic functionality directly at the package and chip level. Instead of relying on multiple discrete components, EnaChip enables a unified platform where power, signal, sensing, and actuation can be designed together. This convergence reduces system complexity, improves performance, and unlocks new classes of devices that were previously impractical.
Toward a broader magnetic platform
EnaChip is positioned at the center of this transition.