News
Press coverage and company updates for the platform, the team, and EnaChip momentum.
Open SectionMedia
Explore EnaChip’s technical work, publications, and perspectives on the future of power delivery.
Press coverage, long-form perspectives, and technical papers framing the platform, the materials, and the system-level shifts behind next-generation power delivery.
News · Perspectives · Papers
Three reading paths into EnaChip's work.
Start with the latest news, dive into long-form perspectives, or go deeper into the technical papers behind the platform.
Perspectives
Long-form insights on materials, manufacturing, architecture, and AI infrastructure.
Open SectionPapers
Technical work and research framing magnetics, manufacturing, and integrated structures.
Open SectionIn the news
EnaChip Raises Funding to Advance Integrated Power Delivery Technology
EnaChip, a developer of wafer-level magnetic technology for semiconductor power delivery announced that it has raised a funding round backed by Stata Capital, Anzu Partners, and Boston Seed Capital.…
Backed by Stata Capital, Anzu Partners, and Boston Seed CapitalSupports engineering and process developmentTargets AI infrastructure, advanced packaging, and edge systems
Featured perspectives
Ideas shaping the next power stack.
Materials & process
Why Integrated Magnetics Have Failed (Until Now)
For decades, the idea of integrating magnetics into semiconductor processes has been explored - and repeatedly fallen short. The limitations have not been conceptual, but physical and manufacturing-driven.…
Read articleManufacturing
Electroplating vs Sputtering: A Process-Level Breakthrough
Most discussions around integrated power focus on circuit topology or control techniques. In reality, the limiting factor has been manufacturing.…
Read articleAI infrastructure
The Missing Layer in AI Infrastructure
AI has transformed the trajectory of computing. But as models grow and infrastructure scales, a new limitation is emerging - not in algorithms, but in physics.…
Read articleUnified systems
Building Toward One Integrated Chip
Modern electronic systems are still built as a collection of separate layers: compute, memory, power. Each is optimized independently, then stitched together.…
Read articleLet’s talk
Power delivery should scale with performance—not limit it.
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