Rebuilding power delivery from first principles: platform, materials, and system-level integration in one visual.
Technology
A New Foundation for Power Delivery
EnaChip allows magnetics to be integrated at the package and chip level – delivering voltage conversion closer to the point-of-load.
Built around advanced magnetic materials, electroplated fabrication, and a clear path from discrete power components to integrated power systems.
A New Foundation for Power Delivery
Power delivery is now limited by materials, process, and distance.
Power delivery has historically been constrained by materials and manufacturing limitations. While semiconductor technology has advanced rapidly, magnetics have remained largely discrete, assembled, and incompatible with wafer-scale integration.
EnaChip changes this by fabricating magnetic and insulating layers directly through semiconductor-compatible electroplating—creating high-density inductive structures that operate efficiently at higher switching frequencies and convert voltage at the point-of-load.
By integrating magnetic inductor structure within the chip package module; voltage is converted exactly where and when it is needed. The architectural implications are significant. Moving power delivery closer to the load improves transient response for dynamic workloads, simplifies system design, and reduces overall footprint.
Localized voltage regulation at the point of load
Reduced IR drop, parasitic losses, and thermal load
Higher compute density with less system complexity
A unified platform for power delivery
Materials science, fabrication, structures, and integration aligned in one architecture.
Materials, fabrication, structures, and system integration designed as a unified power-delivery stack.Electroplated manufacturing replaces slow sputtering with a faster, lower-cost, more scalable approach.
Core technology pillars
Four pillars that make integrated power delivery possible at scale.
EnaChip has developed a wafer-level magnetics platform that enables inductors, transformers, and coils to be fabricated directly using semiconductor-compatible processes. The result is a unified approach where power delivery is no longer external to compute, but embedded within the system itself.
Wafer-Level Magnetics Platform
Power delivery becomes a device layer inside the semiconductor flow.
Advanced magnetic materialsElectrochemical wafer fabricationIntegration with existing IC and packaging flows
EnaChip enables inductors, transformers, and coils to be fabricated directly at the wafer level using semiconductor-compatible processes.
High Bsat Magnetic Alloys
Engineered for high-frequency operation.
~4× higher energy density3× higher resistivity~20× higher operating frequency
Enachip's manufacturing technology enables the use of magnetic alloys that perform well at higher switching frequencies. Higher performance, lower inductor footprint. These materials suppress eddy-current losses and shift power delivery into the Fsw>10 MHz regime, where size reductions compound and integration become feasible.
Electroplated Manufacturing Advantage
A fundamentally more efficient process.
~10× fewer process steps~3× lower manufacturing costSingle-mask laminated cores
Electroplating replaces the slow, costly, and step-heavy sputtering workflows that historically limited integrated magnetics.
High-Density Integrated Structures
Compact, high-current density, high-switching frequency (Fsw), built on wafer and scalable to panels.
InductorsTransformersCoils
Compact power structures can be created directly where system designers need them—inside the package and ultimately within the chip stack.
Performance at scale
System gains compound as voltage conversion moves closer to the load.
EnaChip is building the foundation for a new class of systems where compute and power are designed as one, magnetics are integrated into the semiconductor package, and voltage is down converted at the point of load.
Lower thermal loadHigher compute densityReduced system costCompatible with BEOL and OSAT processesIndependent of process nodeEnables co-packaged or monolithic integration
Discrete power components
Traditional board-level power delivery keeps regulation physically separated from the device load, increasing losses, footprint, and system complexity.
Embedded power in packages
Voltage conversion moves closer to the load through package-level integration, improving efficiency while establishing a practical bridge toward deeper integration.
Vertical power within chips
The end state is power delivered directly to silicon, where electrical, thermal, and architectural efficiency compound together.
Toward fully integrated power systems
Power delivery should scale with performance—not limit it.
EnaChip is building the foundation for systems where power is delivered at the point of load, magnetics are integrated into the package or chip stack, and compute and power are designed as one.