EnaChip, a developer of wafer-level magnetic technology for semiconductor power delivery announced that it has raised a funding round backed by Stata Capital, Anzu…
EnaChip, a developer of wafer-level magnetic technology for semiconductor power delivery announced that it has raised a funding round backed by Stata Capital, Anzu Partners, and Boston Seed Capital.
EnaChip is developing a manufacturing platform that integrates magnetic components - including inductors and transformers - directly into semiconductor processes. The approach is intended to address a longstanding constraint in modern electronics, where power conversion remains physically separated from the chips it serves.
As computing systems, particularly in artificial intelligence and data centers, continue to increase in power density, inefficiencies in power delivery have become more pronounced. Conventional architectures rely on discrete components that add size, cost, and energy loss, limiting system performance and scalability.
EnaChip’s technology uses electroplated magnetic materials and semiconductor-compatible fabrication techniques to enable high-frequency operation and closer integration of power delivery with silicon. By moving power conversion nearer to the point of load, the approach aims to reduce losses, shrink system footprint, and simplify overall system design.
“Over the past several decades, we’ve seen the industry repeatedly move from discrete to integrated solutions, unlocking step-function improvements in performance and cost,” said Ray Stata, founder of Analog Devices and Stata Capital. “Power delivery is one of the remaining frontiers. EnaChip’s approach to integrating magnetics at the wafer level is a fundamentally new direction that aligns with where the industry needs to go. That’s what makes it compelling.”
The company said it will use the funding to expand engineering and process development efforts and to advance collaborations with semiconductor manufacturers, packaging providers, and system companies.
“Power delivery is becoming an increasingly important constraint as compute systems scale,” said Mark Popovich, CEO of EnaChip. “Our focus is on integrating magnetics and power delivery into the semiconductor stack to improve efficiency and enable new system architectures.”
EnaChip’s platform is designed to be compatible with existing semiconductor manufacturing and back-end packaging processes, allowing it to be deployed across a range of applications, including data center infrastructure, advanced packaging, and edge systems.
About EnaChip:
EnaChip is developing a wafer-level magnetics platform that integrates power delivery directly into the semiconductor stack. By combining advanced magnetic materials with electrochemical fabrication processes, the company enables compact, high-efficiency power solutions that scale with modern compute architectures. EnaChip’s technology is designed to support the next generation of AI infrastructure, advanced packaging, and high-performance electronic systems.