Why Power Delivery Is the Next Frontier
Every major transition in semiconductors has been driven by integration.
Logic moved from discrete components to integrated circuits. Memory followed. Packaging is now evolving toward chiplets and 3D stacks.
Power delivery is next.
Today’s systems still rely on discrete magnetics - components that are physically large, inefficient, and disconnected from the silicon they serve. This architecture no longer scales with modern compute.
EnaChip introduces a new paradigm: wafer-level magnetics.
By fabricating inductors, transformers, and magnetic structures directly within semiconductor-compatible processes, EnaChip enables power delivery to be integrated into the package - and ultimately, into the chip itself.
This unlocks:
More importantly, it enables something the industry has not yet achieved: true co-design of power and compute.
The result is a new class of systems - where power is not a constraint, but a built-in advantage.